| Company (Country) | Build | Laminate | Surface Finish | Qual. Expiration | Qualif Status | Status date | Reference |
| GRAPHIC (UK) | DS | Polyimide | Fused Sn/Pb | - | Evaluation ongoing | 2009 | - |
| ML | |||||||
| Sequential | |||||||
| LABTECH (UK) | DS – microwave | Duroid RT 6002 | Cu, passivated Cu, Cu+Au, Cu+Ni+Au, Cu+Ni+Au+soft Au | September 2005 | New evaluation sample to be sent May09 | 01/09/2003 | QM/03-199/CV |
| DS – microwave | Duroid RT 6002 with Al back-plane | Cu, passivated Cu, Cu+Ni+ Au, Cu+Ni+Au+soft Au | September 2005 | New evaluation sample to be sent May09 | 01/09/2003 | QM/03-199/CV | |
| PRINTCA (DK) | DS | Epoxy | Fused SnPb | March 2009 | sample received on 9Nov09 | 10/11/2009 | QM/06-574/CV |
| ML | QM/06-574/CV | ||||||
| ML Rigid-flex | QM/05-190/CV | ||||||
| Sequential | December 2007 | obsolete product | 01/07/2005 | QM/06-574/CV | |||
| DS | HTg epoxy | Fused SnPb | - | Qualification foreseen | 2009 | - | |
| ML | |||||||
| Sequential | |||||||
| DS | Polyimide | Fused SnPb | May 2011 | Qualified | 20/05/2009 | QT/2009/1048/SH | |
| ML | |||||||
| Sequential | |||||||
| ML Rigid Flex | July 2007 | sample received on 1Nov09 | 10/11/2009 | - | |||
| Seq Rigid Flex | |||||||
| ML | Thermount/Polyimide | Fused SnPb | May 2011 | Qualified | 20/05/2009 | QT/2009/1048/SH | |
| Sequential | |||||||
| DS | Duroid RT6002 | Fused SnPb | May 2009 | evaluation samples to be sent by June 2009 | 20/05/2009 | QM/06-574/CV | |
| STRASCHU (D) | DS | Epoxy | Fused SnPb | September 2009 | qualification ongoing | 10/12/2007 | - |
| ML | |||||||
| SYSTRONIC (F) | DS | HTg Epoxy | Fused SnPb | June 2010 | qualified | 01/06/2008 | QM/08-910/CV |
| ML | |||||||
| Sequential | |||||||
| ML Rigid-flex | HTg Epoxy | Fused SnPb | July 2011 | qualified | 14/07/2009 | QT/2009/1081/SH | |
| DS | Polyimide | Fused SnPb | November 2009 | evaluation ongoing | 10/12/2009 | - | |
| ML | |||||||
| Sequential | |||||||
| ML Rigid-flex | Polyimide | Fused SnPb | July 2010 | qualified | 01/07/2008 | QM/08-920/CV | |
| Sequential Rigid-flex | |||||||
| DS flexible | Polyimide | Fused SnPb | July 2011 | qualified | 14/07/2009 | QT/2009/1081/SH | |
| DS | Duroid RT5880 | Au- Hyper and selective fused SnPb | November 2009 | evaluation ongoing | 10/12/2009 | - | |
| DS - microwave | TMM 10I | Au- Hyper and selective fused SnPb | November 2009 | evaluation ongoing | 10/12/2009 | - | |
| TESAT SPACECOM (D) | DS | Epoxy with or without internal partial metal core | Fused SnPb and intermetallic diffusion layer | September 2008 | Obsolete product | 20/03/2006 | QM/06-381/CV |
| ML | |||||||
| Sequential | |||||||
| DS | Epoxy HTg with or without internal partial metal core | Fused SnPb and intermetallic diffusion layer | February 2011 | qualified | Feb-09 | QM/2009/1017/SH | |
| ML | |||||||
| Sequential | |||||||
| Legend: | |||||||
| black font | qualified | ||||||
| red font | qualification ongoing | ||||||
| green font | future qualification | ||||||
| blue font | past qualification, obsolete product | ||||||