A.2.3. Brass (a-b) Leaded

PRODUCT

Type

Metal Alloy

Chemical Composition

40% Zn, 2% Pb, Rem. Cu

Manufacturer

H. Rollet & Co. Ltd.

105 107 Fore Street, Hertford

Hertfordshire SG14 1AS,

UK

Tel: +44 (0)1992 500818

Fax: +44 (0)1992 509905

Email:

www.hrollet.co.uk

EXPERIENCE & AVAILABILITY

Development Status

Commercial Product

Cost Range

Very Low

Lot Reproducibility

ASTM B1224/2, BS 2870 CZ120, CuZn40Pb2

Space Experience

Good

GENERAL PROPERTIES (Physical, Mechanical, Thermal, Electrical, Optical)

Nature

Typical Value

Remarks

Specific Gravity

8.4

@ Room Temperature

Ultimate Tensile Strength

350 to 460 MPa

@ Room Temperature

Proof Stress (0.2%)

100 to 390 MPa

@ Room Temperature

Elongation at Break

20 to 45%

@ Room Temperature

Thermal Conductivity

117 W m -1 C -1

@ Room Temperature

Thermal Expansion Coefficient

20.9 x 10-6 C -1

@ Room Temperature

PROPERTIES RELEVANT TO SPACE USE

Nature

Typical Value

Type of Test

Atmospheric Corrosion

Thew resistance to atmospheric corrosion is fair. The material is generally plated for protection.

 

Stress Corrosion

The resistance to stress corrosion is low (see notes).

 

SPECIAL RECOMMENDATIONS

          When this material is used for PCB terminals (machined), there must be a Copper or Nickel diffusion barrier (3mm) between the solder coating and the brass,(See: ECSS-Q-70-08). For swaged terminals, the lead-free variety should be used.

          Resistance to stress corrosion is low when the material is 50% cold rolled. Furthermore, it should not be used in stressed conditions. See ECSS-Q-70-36 for alternative copper alloys with high resistance to stress corrosion.