A.2.3. Brass (a-b)
Leaded
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PRODUCT |
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Type |
Metal Alloy |
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Chemical Composition |
40% Zn, 2% Pb, Rem. Cu |
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Manufacturer |
H. Rollet & Co. Ltd. 105 –
107 Fore Street, Hertford Hertfordshire
SG14 1AS, UK |
Tel: +44 (0)1992 500818 Fax: +44 (0)1992 509905 Email: www.hrollet.co.uk |
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EXPERIENCE & AVAILABILITY |
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Development Status |
Commercial Product |
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Cost Range |
Very Low |
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Lot Reproducibility |
ASTM B1224/2, BS 2870 CZ120, CuZn40Pb2 |
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Space Experience |
Good |
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GENERAL PROPERTIES (Physical,
Mechanical, Thermal, Electrical, Optical) |
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Nature |
Typical Value |
Remarks |
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Specific Gravity |
8.4 |
@ Room Temperature |
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Ultimate Tensile Strength |
350 to 460 MPa |
@ Room Temperature |
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Proof Stress (0.2%) |
100 to 390 MPa |
@ Room Temperature |
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Elongation at Break |
20 to 45% |
@ Room Temperature |
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Thermal Conductivity |
117 W m -1 °C -1 |
@ Room Temperature |
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Thermal Expansion Coefficient |
20.9 x 10-6 °C -1 |
@ Room Temperature |
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PROPERTIES RELEVANT TO SPACE USE |
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Nature |
Typical Value |
Type of Test |
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Atmospheric Corrosion |
Thew resistance to atmospheric corrosion is fair. The
material is generally plated for protection. |
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Stress Corrosion |
The resistance to stress corrosion is low (see notes). |
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SPECIAL RECOMMENDATIONS |
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·
When this material is used for PCB terminals
(machined), there must be a Copper or Nickel diffusion barrier (3mm)
between the solder coating and the brass,(See: ECSS-Q-70-08). For swaged
terminals, the lead-free variety should be used. ·
Resistance to stress corrosion is low when the
material is 50% cold rolled. Furthermore, it should not be used in stressed
conditions. See ECSS-Q-70-36 for alternative copper alloys with high
resistance to stress corrosion. |
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