A.1.1 Soft Solder, Sn63 (Space Quality)
PRODUCT
Type			Metal Alloy; Wire, Bar and Flux-cored Wire
Chemical Composition			63% Sn, 37% Pb
Manufacturer	JL Goslar GmbH Postfach 2129, D-38611 Goslar Deutschland			Tel: +49 (0) 5321 / 754-332 Fax: +49 (0) 5321 / 754-333 Email: h.walk@jlgoslar.de www.jlgoslar.de
EXPERIENCE & AVAILABILITY
Development Status			Commercial Product
Cost Range			Low
Lot Reproducibility			ECSS-Q-70-08 / 1999: 63 Tin Solder, EN 29453 / 1993: S-Sn63 Pb37 E
Space Experience			Good
GENERAL PROPERTIES (Physical, Mechanical, Thermal, Electrical, Optical)
Nature			Typical Value		Remarks
Specific Gravity			8.5		@ Room Temperature
Ultimate Tensile Strength			47 MPa		@ Room Temperature
Proof Stress (0.2%)			35 MPa		@ Room Temperature
Elongation at Break			46%		@ Room Temperature
Thermal Expansion Coefficient			16.0 x 10^-6 °C^-1		@ Room Temperature
PROPERTIES RELEVANT TO SPACE USE
Nature		Typical Value				Type of Test
Temperature Range		Suitable for extensive periods at +80°C or short periods to a maximum of +120°C.
Thermal Cycling		Test programme showed no electrical failures after 1000 cycles.				Joints made to ECSS-Q-70-08 requirements; -60°C to +80°C under vacuum with DT of 10°C/min.
SPECIAL RECOMMENDATIONS
· Mandatory for the assembly of components on printed circuit boards (ECSS-Q-70-08).