A.1.1        Soft Solder, Sn63 (Space Quality)

PRODUCT

Type

Metal Alloy; Wire, Bar and Flux-cored Wire

Chemical Composition

63% Sn, 37% Pb

Manufacturer

JL Goslar GmbH

Postfach 2129,

D-38611 Goslar

Deutschland

Tel: +49 (0) 5321 / 754-332

Fax: +49 (0) 5321 / 754-333

Email: h.walk@jlgoslar.de

www.jlgoslar.de

EXPERIENCE & AVAILABILITY

Development Status

Commercial Product

Cost Range

Low

Lot Reproducibility

ECSS-Q-70-08 / 1999: 63 Tin Solder, EN 29453 / 1993: S-Sn63 Pb37 E

Space Experience

Good

GENERAL PROPERTIES (Physical, Mechanical, Thermal, Electrical, Optical)

Nature

Typical Value

Remarks

Specific Gravity

8.5

@ Room Temperature

Ultimate Tensile Strength

47 MPa

@ Room Temperature

Proof Stress (0.2%)

35 MPa

@ Room Temperature

Elongation at Break

46%

@ Room Temperature

Thermal Expansion Coefficient

16.0 x 10-6 C -1

@ Room Temperature

PROPERTIES RELEVANT TO SPACE USE

Nature

Typical Value

Type of Test

Temperature Range

Suitable for extensive periods at +80C or short periods to a maximum of +120C.

 

Thermal Cycling

Test programme showed no electrical failures after 1000 cycles.

Joints made to ECSS-Q-70-08 requirements; -60C to +80C under vacuum with DT of 10C/min.

SPECIAL RECOMMENDATIONS

          Mandatory for the assembly of components on printed circuit boards (ECSS-Q-70-08).