A.7.4. Tin-Silver Eutectic Solder, (Space Quality) |
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PRODUCT |
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Type |
Metal Alloy; Wire, Bar and Flux-cored Wire |
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Chemical Composition |
96% Sn, 4% Ag |
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Manufacturer |
JL Goslar GmbH Postfach 2129, D-38611 Goslar Deutschland |
Tel: +49 (0) 5321 / 754-332 Fax: +49 (0) 5321 / 754-333 Email: h.walk@jlgoslar.de www.jlgoslar.de |
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EXPERIENCE & AVAILABILITY |
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Development Status |
Commercial Product |
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Cost Range |
Medium |
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Lot Reproducibility |
ECSS-Q-70-08 / 1999: 96 Tin Silver Solder (Eutectic), EN 29453 / 1993: S-Sn96 Ag4 |
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Space Experience |
Limited |
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GENERAL PROPERTIES (Physical, Mechanical, Thermal, Electrical, Optical) |
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Nature |
Typical Value |
Remarks |
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Specific Gravity |
10.4 |
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Ultimate Tensile Strength |
36 MPa |
@ Room Temperature |
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Elongation at Break |
31% |
@ Room Temperature |
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Thermal Expansion Coefficient |
20 x 10-6 °C -1 |
@ Room Temperature |
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Electrical Resistivity |
1.23 x 10-6 W m |
@ Room Temperature |
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PROPERTIES RELEVANT TO SPACE USE |
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Nature |
Typical Value |
Type of Test |
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Temperature Range |
Suitable for extensive periods at +120°C or short periods to a maximum of +150°C. |
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SPECIAL RECOMMENDATIONS |
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· Is suitable for for special applications, such as solder attachment of terminal posts to one side of a printed circuit board (ECSS-Q-70-08) and for assembly of connectors to semi-rigid cables. |
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