A.7.4. Tin-Silver Eutectic Solder, (Space Quality) |
||||||
PRODUCT |
||||||
Type |
Metal Alloy; Wire, Bar and Flux-cored Wire |
|||||
Chemical Composition |
96% Sn, 4% Ag |
|||||
Manufacturer |
JL Goslar GmbH Postfach 2129, D-38611 Goslar Deutschland |
Tel: +49 (0) 5321 / 754-332 Fax: +49 (0) 5321 / 754-333 Email: h.walk@jlgoslar.de www.jlgoslar.de |
||||
EXPERIENCE & AVAILABILITY |
||||||
Development Status |
Commercial Product |
|||||
Cost Range |
Medium |
|||||
Lot Reproducibility |
ECSS-Q-70-08 / 1999: 96 Tin Silver Solder (Eutectic), EN 29453 / 1993: S-Sn96 Ag4 |
|||||
Space Experience |
Limited |
|||||
GENERAL PROPERTIES (Physical, Mechanical, Thermal, Electrical, Optical) |
||||||
Nature |
Typical Value |
Remarks |
||||
Specific Gravity |
10.4 |
|
||||
Ultimate Tensile Strength |
36 MPa |
@ Room Temperature |
||||
Elongation at Break |
31% |
@ Room Temperature |
||||
Thermal Expansion Coefficient |
20 x 10-6 °C -1 |
@ Room Temperature |
||||
Electrical Resistivity |
1.23 x 10-6 W m |
@ Room Temperature |
||||
PROPERTIES RELEVANT TO SPACE USE |
||||||
Nature |
Typical Value |
Type of Test |
||||
Temperature Range |
Suitable for extensive periods at +120°C or short periods to a maximum of +150°C. |
|
||||
SPECIAL RECOMMENDATIONS |
||||||
· Is suitable for for special applications, such as solder attachment of terminal posts to one side of a printed circuit board (ECSS-Q-70-08) and for assembly of connectors to semi-rigid cables. |
||||||