A.7.4. Tin-Silver Eutectic Solder, (Space Quality)

PRODUCT

Type

Metal Alloy; Wire, Bar and Flux-cored Wire

Chemical Composition

96% Sn, 4% Ag

Manufacturer

JL Goslar GmbH

Postfach 2129,

D-38611 Goslar

Deutschland

Tel: +49 (0) 5321 / 754-332

Fax: +49 (0) 5321 / 754-333

Email: h.walk@jlgoslar.de

www.jlgoslar.de

EXPERIENCE & AVAILABILITY

Development Status

Commercial Product

Cost Range

Medium

Lot Reproducibility

ECSS-Q-70-08 / 1999: 96 Tin Silver Solder (Eutectic),

EN 29453 / 1993: S-Sn96 Ag4

Space Experience

Limited

GENERAL PROPERTIES (Physical, Mechanical, Thermal, Electrical, Optical)

Nature

Typical Value

Remarks

Specific Gravity

10.4

 

Ultimate Tensile Strength

36 MPa

@ Room Temperature

Elongation at Break

31%

@ Room Temperature

Thermal Expansion Coefficient

20 x 10-6 C -1

@ Room Temperature

Electrical Resistivity

1.23 x 10-6 W m

@ Room Temperature

PROPERTIES RELEVANT TO SPACE USE

Nature

Typical Value

Type of Test

Temperature Range

Suitable for extensive periods at +120C or short periods to a maximum of +150C.

 

SPECIAL RECOMMENDATIONS

          Is suitable for for special applications, such as solder attachment of terminal posts to one side of a printed circuit board (ECSS-Q-70-08) and for assembly of connectors to semi-rigid cables.