A.10.6. Eccobond “Solder” 56C
PRODUCT
Type			Electrically-conductive adhesive paste.
Chemical Composition			Epoxy – Silver-loaded.
Manufacturer	Emerson & Cumming Nijerheidsstraat 7, B-2260 Westerlo Belgium			Tel: +32 14 56 25 00 Fax: +32 14 56 25 01 Email: www.emersoncuming.com
EXPERIENCE & AVAILABILITY
Development Status			Commercial Product
Cost Range			High
Lot Reproducibility			Excellent
Space Experience			Extensive
GENERAL PROPERTIES (Physical, Mechanical, Thermal, Electrical, Optical)
Nature			Typical Value		Remarks
Shear Strength			5.65 MPa		Manufacturer’s Data
Thermal Expansion Coefficient			36 x 10^-6 °C^-1		Manufacturer’s Data
Thermal Conductivity			5.8 W m^-1 °C^-1		Manufacturer’s Data
Electrical Resistivity (volume)			2 x 10^-6 W m		Manufacturer’s Data
PROPERTIES RELEVANT TO SPACE USE
Nature		Typical Value				Type of Test
Temperature Range		-60°C to +175°C.				Manufacturer’s Data
Outgassing		TML = 0.30%, RML =0.20%, CVCM = 0.02%				ECSS-Q-70-02
Flammability		Pass (23.8% O2)				NASA NHB 8060-1B
Toxicity/Offgassing		Pass				NASA NHB 8060-1A
SPECIAL RECOMMENDATIONS
· Recommended proportions are: 100 pbw resin + 2.5 pbw catalyst 9. · Recommended cure is 16 hours at 50°C. · Peel strength of this adhesive is low. Cycling to subzero temperatures can be detrimental. · Electrical bonds made with this adhesive to metals having a different EMF are likely to degrade in a humid environment, particularly if the metal layers are thin (e.g. vacuum deposits). · Different catalysts are available which will affect the properties, including temperature range and processing recommendations. Space experience with catalysts 9 and 11 is available.