| High Reliablilty Soldering for Surface-mount and mixed-technology printed-circuit boards - ESA PSS-01-738
The manual soldering of high-reliability electrical connections - ECSS-Q-70-08 latest
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Assessment of the Reliability of Solder Joints to Ball and Column Grid Array Packages for Space Applications - P.-E. Tegehall (IVF) and B. D. Dunn (ESA-ESTEC). ESA
STM-266
Evaluation of Thermally Conductive Adhesives as Staking Compounds during the Assemby of Spacecraft Electronics - P.-E. Tegehall (IVF) and B. D. Dunn (ESA-ESTEC). ESA
STM-265
Evaluation of Conformal coatings for future spacecraft applications. - B.D. Dunn(ESA-ESTEC) and P. Desplat (EADS-Astrium, Velizy). ESA SP-1173
Impact of Cracking beneath Solder Pads in Printed Board Laminate on Reliability of Solder Joints to Ceramic Ball Grid Array Packages - P.-E. Tegehall (IVF) and B. D. Dunn (ESA-ESTEC), ESA STM 267
Partial Discharge Testing of Solder Fillets on PCBs in a Partial Vacuum: New Experimental Results - Lorenzo Capineri, Member, IEEE, Gabriele Dainelli, Maurizio Materassi, and Barrie D. Dunn
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , VOL. 26, NO. 4, OCTOBER 2003
An Investigation Into Ball Grid Array Inspection Techniques - M. Wickham, C. Hunt, NPL (UK), D.M. Adams, B.D. Dunn - ESA-ESTEC
Impact of Reworking Ceramic Area Array Packages on the Integrity of the Printed Board Laminate - P.-E. Tegehall (IVF) and B. D. Dunn (ESA-ESTEC), ESA STM-273
Evaluation of Cleanliness Test Methods for Spacecraft PCB Assemblies- P.-E. Tegehall (IVF) and B. D. Dunn (ESA-ESTEC), ESA STM-275
Measurement of mechanical properties of electronic materials at temperatures down to 4.2 K - M. Fink a, Th. Fabing, M. Scheerer, E. Semerad - ARC Seibersdorf - Austria, B. Dunn - ESA/ESTEC - The Netherlands
Surface Resistivity Characterization of New Printed Circuit Board Materials for Use in Spacecraft Electronics
Andrea Bulletti, Lorenzo Capineri, Senior Member, IEEE, Maurizio Materassi, and Barrie D. Dunn
ESA-APPROVED SKILLS TRAINING SCHOOLS (Electronic Assembly Techniques) - B.D.DUNN, Product Assurance and Safety Department, ESA/ESTEC-TEC-Q, ESA STR-258
Workmanship standards and their application on ESA projects - Barrie D. Dunn, ESA-ESTEC, Noordwijk, The Netherlands
Measurement of mechanical properties of electronic materials at temperatures down to 4.2 K - M. Fink, Th. Fabing, M. Scheerer, E. Semerad, B. Dunn
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